Types of assembly: SMT, BGA, DIP, SIP, Mixed Assembly, etc.

Components footprint: 0201,0402, 0603, 0805,…

Components type: BGA, QFN, QFP, PLCC, SOIC, POP, Connectors

Processes: Lead-free Soldering, AOI, Ware Soldering, Reflow Soldering, X-ray testing, Rework, Conformal Coating, Functional Testing, Packaging.